cystech electronics corp. spec. no. : c413n3 issued date : 2007.07.05 revised date : page no. : 1/5 MTN2300N3 cystek product specification 20v n-channel enhancement mode mosfet MTN2300N3 features ? v ds =20v r ds(on) =28m @v gs =4.5v, i ds =6a r ds(on) =38m @v gs =2.5v, i ds =5.2a ? low on-resistance ? capable of 2.5v gate drive ? excellent thermal and electrical capabilities ? compact and low profile sot-23 package equivalent circuit outline absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage v ds 20 v gate-source voltage v gs 8 v continuous drain current @ t a =25 c (note 3) i d 6 a continuous drain current @ t a =70 c (note 3) i d 4.8 a pulsed drain current (note 1, 2) i dm 20 a maximum power dissipation @ t a =25 1.25 w linear derating factor p d 0.01 w/ c thermal resistance, junction-to-ambient r th,ja 100 c/w operating junction and storage temperature tj, tstg -55~+150 c note : 1. pulse width limited by maximum junction temperature. 2. pulse width 300 s, duty cycle 2%. 3. surface mounted on fr-4 board, t 10sec. MTN2300N3 sot-23 d g gate s g s source d drain
cystech electronics corp. spec. no. : c413n3 issued date : 2007.07.05 revised date : page no. : 2/5 MTN2300N3 cystek product specification electrical characteristics (ta=25 c) symbol min. typ. max. unit test conditions static bv dss 20 - - v v gs =0, i d =250 a ? bv dss / ? tj - 0.1 - v/ c reference to 25c, i d =1ma v gs(th) 0.5 - 1.0 v v ds =v gs , i d =250 a i gss - - 100 na v gs = 8v, v ds =0 i dss - - 1 a v ds =20v, v gs =0 i dss - - 25 a v ds =16v, v gs =0, tj=70 c *r ds(on) - - 28 i d =6a, v gs =4.5v - - 38 m i d =5.2a, v gs =2.5v dynamic ciss - 550 - coss - 120 - crss - 80 - pf v ds =15v, v gs =0, f=1mhz t d(on) - 8 - t r - 6 - t d(off) - 19 - t f - 7 - ns v dd =10v, i d =1a, v gs =4.5v, r g =0.2 qg - 10 - qgs - 3.6 - qgd - 2 - nc v ds =10v, i d =6a, v gs =4.5v source-drain diode *v sd - 0.7 1.3 v v gs =0v, i s =1.25a *pulse test : pulse width 300 s, duty cycle 2% ordering information device package shipping marking MTN2300N3 sot-23 (pb-free) 3000 pcs / tape & reel 2300
cystech electronics corp. spec. no. : c413n3 issued date : 2007.07.05 revised date : page no. : 3/5 MTN2300N3 cystek product specification characteristic curves
cystech electronics corp. spec. no. : c413n3 issued date : 2007.07.05 revised date : page no. : 4/5 MTN2300N3 cystek product specification characteristic curves(cont.)
cystech electronics corp. spec. no. : c413n3 issued date : 2007.07.05 revised date : page no. : 5/5 MTN2300N3 cystek product specification sot-23 dimension h j k d a l g v c b 3 2 1 s style: pin 1.gate 2.source 3.drain marking: te 3-lead sot-23 plastic surface mounted package cystek package code: n3 2300 *: typical dim inches millimeters inches millimeters min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0034 0.0070 0.085 0.177 b 0.0472 0.0630 1.20 1.60 k 0.0128 0.0266 0.32 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1083 2.10 2.75 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0005 0.0040 0.013 0.10 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material: ? lead: 42 alloy ; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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